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TDS_Copper Oxide.pptx
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Copper (Ⅱ) Oxide SS-CuO
| FORMULA | CuO CAS NO. 1317-38-0 |
| APPEARANCE | Black Powder |
| USES | - Cu ion supplied upon electrolytic copper plating and copper sulfate plating (Via-Fill, Through Hole, PCBs and etc) - High-purity raw chemical used for manufacturing various types of copper salt - Electrolytic/Electroless copper plating - Vertical or horizontal plating method can be interchanged |
| ADVANTAGE | - Domestic market share no.1 - Import substitution effect owing to the first development in Korea and successful commercialization - Reliability verified as used by large companies in Korea - Outstanding stability of plating thickness owing to the small amount of impurities - Extremely little residual chlorine and organic matters |
| PACKING | 25KGS NET IN P.E BAG / 250KG 300KG PE DRUM / ETC |
SPECIFICATION
| Item | Unit | Spec |
| CuO | % | Min 97.0 |
| Cu | % | Min 77.0 |
| Fe | % | Max 0.005 |
| Pb | % | Max 0.001 |
| Cl | ppm | Max 0.001 |
| Moisture | % | Max 0.35 |
| Dissolution time in | Sec | Max 40 |
